Apparatus and method for producing semiconductor substrate

Details Apparatus and method for producing semiconductor substrate Apparatus and method for producing semiconductor substrate

1990-09-10

1992-01-28

Bueker, Richard

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118715, 118719, 118723, H01L 2100

Patent

active

050841254

ABSTRACT:
A semiconductor substrate production in which the treatment of semiconductor substrates and the removal of deposits previously formed on the used wall portion are simultaneously performed, so that at least two wall portions alternately constitute the substrate treating chamber after cleaning, thereby continuing the production of semiconductor substrates without breaks for the removal of detrimental deposits.

REFERENCES:
patent: 4668337 (1987-05-01), Sekine et al.
patent: 4716852 (1988-01-01), Tsujii et al.
patent: 4857139 (1989-08-01), Tashiro et al.
patent: 4910042 (1990-03-01), Hokynar

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