Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent
1997-03-12
1999-11-30
Heinrich, Samuel M.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
228 41, 228 52, 2281115, 228244, H05K 1306, H01L 2160
Patent
active
059927259
ABSTRACT:
An electronic element producing apparatus comprises a bonding tool 1 which has a first supply hole 2 for passing a bonding wire 3 used to bond a bonding pad 6 of a semiconductor device 5 and an external conductor which is to be connected electrically with the bonding pad 6, and contacts a leading end 3b of the bonding wire 3 protruded outside from the first supply hole 2 to the bonding pad 6, and which also has a second supply hole 12 to supply a bonding material to bond the bonding pad 6 and the leading end 3b of the bonding wire 3, the second supply hole 12 being formed to supply the conductive material to a contact point between the bonding wire 3 and the bonding pad 6. Therefore, the bonding pad 6 and the bonding wire 3 can be bonded without applying a dynamic or thermal load to the semiconductor device 5.
REFERENCES:
patent: 3672047 (1972-06-01), Sakamoto et al.
patent: 4315128 (1982-02-01), Matcovich et al.
patent: 4564734 (1986-01-01), Okikawa
patent: 4598855 (1986-07-01), Bell et al.
patent: 4765526 (1988-08-01), Sato
patent: 5328078 (1994-07-01), Okumura
patent: 5735451 (1998-04-01), Mori et al.
Egawa Hidemitsu
Ezawa Hirokazu
Heinrich Samuel M.
Kabushiki Kaisha Toshiba
LandOfFree
Apparatus and method for producing electronic elements does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for producing electronic elements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for producing electronic elements will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1661773