Apparatus and method for producing an electronic component provi

Details Apparatus and method for producing an electronic component provi Apparatus and method for producing an electronic component provi

1996-06-11

1998-11-03

Walberg, Teresa J.

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

219 8512, 219 8518, 219 8519, 219 8522, 22818021, 22818022, 228246, 228 41, F27B 906, B23K 306, B23K 308

Patent

active

058312471

ABSTRACT:
The invention provides an apparatus and a method for producing an electronic component provided with bumps, in which the operation of placing a solder ball serving as a material of a bump onto an electrode of a work is monitored, and if a solder ball placing failure is detected, a recovering operation is automatically performed. In the apparatus and method of the invention, a head is moved to a location above a solder ball supplying unit so as to pick up solder balls by means of suction. The head is then moved to a location above a flux reservoir so that the solder balls are coated with flux. The head is further moved to a location above a substrate and the solder balls are placed on electrodes of the substrate. The substrate is then observed using a camera to decide whether solder balls are correctly placed on the electrodes. If yes, the substrate is transferred into a heating furnace. On the other hand, if a solder ball placing failure is detected, the solder balls are removed using a nozzle and the step of placing solder balls is performed again.

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