Apparatus and method for processing wafers

Details Apparatus and method for processing wafers Apparatus and method for processing wafers

2006-06-20

2006-06-20

Fuller, Rodney (Department: 2851)

Photocopying

Projection printing and copying cameras

Detailed holder for photosensitive paper

C355S077000

Reexamination Certificate

active

07064809

ABSTRACT:
An apparatus for processing semiconductor wafers includes: a wafer support with a first positioning system that can rotate the wafer support coaxially with a wafer; at least one processing apparatus, which can be moved with a second positioning system such that a processing tool proceeding from the processing apparatus can be guided radially over the wafer; and at least one position determining apparatus for determining a wafer position on the basis of features of the wafer. Alignment marks of the wafer are found and points to be processed, such as laser fuses, are moved by rotation of the wafer and movement of at least one processing apparatus in the radial direction above the wafer.

REFERENCES:
patent: 4792658 (1988-12-01), Langhans et al.
patent: 5029243 (1991-07-01), Dammann et al.
patent: 5479108 (1995-12-01), Cheng
patent: 5558110 (1996-09-01), Williford, Jr.
patent: 5623473 (1997-04-01), Ichihara
patent: 5982166 (1999-11-01), Mautz
patent: 6009888 (2000-01-01), Ye et al.
patent: 6307617 (2001-10-01), Nishiki et al.
patent: 6442312 (2002-08-01), Terao et al.
patent: 6496245 (2002-12-01), Kosugi et al.
patent: 6541747 (2003-04-01), Kikuchi et al.
patent: 6592435 (2003-07-01), Kishima
patent: 2004/0060910 (2004-04-01), Schramm
patent: 44 20 347 (1995-12-01), None
Data Sheet, “Wafer Repair M430”, GSI Lumonics, Jan. 2003, 2 pages.
Data Sheet, “Modell 9800”, Electro Scientific Industries, Inc. USA, Feb. 2001, 2 pages.

Affiliated with

Also associated with

Rating

Apparatus and method for processing wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for processing wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for processing wafers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3708928