Optics: measuring and testing – Dimension – Thickness
Reexamination Certificate
2007-01-09
2007-01-09
Toatley, Jr., Gregory J. (Department: 2877)
Optics: measuring and testing
Dimension
Thickness
C438S005000, C438S007000, C438S014000, C438S016000, C205S081000, C205S084000, C204S228700
Reexamination Certificate
active
10685306
ABSTRACT:
A processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. The control can modify a process recipe or a process sequence of the processing apparatus based on a feed forward or a feed back signal from the metrology unit. A seed layer deposition tool, a process layer electrochemical deposition tool, and a chemical mechanical polishing tool, arranged for sequential processing of a workpiece, can be controlled as an integrated system using one or more metrology units. A metrology unit can be located at each tool to measure workpiece parameters. Each of the metrology units can be used as a feed forward control and/or a feed back control at each of the tools.
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International Search Report for International Application No. PCT/US01/21579 mailed Nov. 16, 2001; Applicant: Semitool, Inc. 3 pgs.
Eudy Steve L.
McHugh Paul R.
Ritzdorf Thomas L.
Wilson Gregory J.
Semitool Inc.
Stock, Jr. Gordon J.
Toatley , Jr. Gregory J.
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