Metal fusion bonding – Including means to apply flux or filler to work or applicator
Reexamination Certificate
2003-06-24
2008-03-25
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Reexamination Certificate
active
07347349
ABSTRACT:
A method and device for printing liquid material such as liquid solder is provided. C4 structures as small as 10 microns in diameter can be produced using devices and methods described above. Further, devices and methods provided are able to operate at temperatures much higher than other print head designs such as piezoelectric actuated print heads. Additionally, due to the use of a gas flow restricting device and a recharging gas supply, ejection devices as described above can be used for a substantially extended lifetime, thus making devices and methods described above more economically desirable.
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Eldridge Jerome M.
Farrar Paul A.
Johnson Jonathan
Micro)n Technology, Inc.
Schwegman Lundberg & Woessner, P.A.
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