Apparatus and method for preventing chamber contamination

Coating apparatus – Gas or vapor deposition

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156345, 55312, C23C 1600

Patent

active

061066265

ABSTRACT:
An apparatus and a method for preventing contamination to a low pressure chemical vapor deposition chamber (LPCVD) are provided. The apparatus includes an exhaust-vent device which is connected to a vent outlet and a vacuum pump on a process chamber in parallel with and bypassing a gate valve such that the exhaust-vent remains open during a continuous pumping of the process chamber for wafer loading and unloading. The exhaust-vent device is constructed by two end conduits that have a larger diameter connected by a middle conduit that has a smaller diameter such that during vacuum evacuation, the fluid flow rate in the smaller diameter conduit is at least four times that in the large conduit to effectively prevent the deposition in the small conduit of reaction by-products. The present invention apparatus may further be enhanced by mounting heating tapes on the vacuum conduits and heating the conduits to a temperature of between about 100.degree. C. and about 180.degree. C. to further prevent the deposition of contaminating particles on the interior walls of the conduits.

REFERENCES:
patent: 4906257 (1990-03-01), Fukunaga et al.
patent: 4910042 (1990-03-01), Hokynar
patent: 5888579 (1999-03-01), Lun

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for preventing chamber contamination does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for preventing chamber contamination, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for preventing chamber contamination will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-576103

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.