Apparatus and method for precision trimming of integrated...

Electrical resistors – In detachable electrical connector

Reexamination Certificate

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C338S195000

Reexamination Certificate

active

11274491

ABSTRACT:
An apparatus and method for using anti-fuse bond pads used to provide trimmed resistor values to the input terminals of circuits on an integrated circuit die. The apparatus and method comprises fabricating on a semiconductor integrated circuit a resistive network. The resistive network includes a first terminal, a second terminal and a resistor coupled between the two terminals. An anti-fuse bond pad and a trimming resistor are coupled between the first terminal and the second terminal. The trimming resistor is configured to be electrically coupled between the first terminal and the second terminal when a ball bond is formed on the anti-fuse bond pad. In various embodiments, a plurality of the anti-fuse bond pads and trimming resistors may be coupled between the two terminals. By selectively forming ball bonds on the plurality of anti-fuse bond pads, the resistance of the network can be selectively trimmed as needed.

REFERENCES:
patent: 5235205 (1993-08-01), Lippitt, III
patent: 5394019 (1995-02-01), Audy
patent: 5422298 (1995-06-01), Jimenez
patent: 5682049 (1997-10-01), Nguyen
patent: 5710538 (1998-01-01), Zinn et al.
patent: 6529116 (2003-03-01), Van Den Broek et al.

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