Apparatus and method for polishing workpiece

Details Apparatus and method for polishing workpiece Apparatus and method for polishing workpiece

1996-05-02

1997-09-23

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

1566361, 216 88, 216 89, 451 41, 451288, B24B 722

Patent

active

056700113

ABSTRACT:
A workpiece such as a semiconductor wafer is polished to a flat mirror finish. The workpiece is held by a top ring, and a lower surface of the workpiece is polished by pressing the workpiece against an abrasive cloth mounted on a turntable while applying an abrasive solution onto the abrasive cloth. While the workpiece is being polished, an upper surface of the semiconductor wafer is prevented from being etched by supplying a neutralizer between the upper surface of the semiconductor wafer and the holding surface of the top ring.

REFERENCES:
patent: 4193226 (1980-03-01), Gill, Jr. et al.
patent: 4680893 (1987-07-01), Cronkhite et al.
patent: 5476414 (1995-12-01), Hirose et al.

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