Apparatus and method for polishing semiconductor wafers...

Details Apparatus and method for polishing semiconductor wafers... Apparatus and method for polishing semiconductor wafers...

2005-08-18

2008-05-06

Rose, Robert (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S041000

Reexamination Certificate

active

07367866

ABSTRACT:
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the pivotable load/unload cups are located between the object carriers.

REFERENCES:
patent: 7229339 (2007-06-01), Stumpf et al.
patent: 2003/0003852 (2003-01-01), Jeong
patent: 2005/0227595 (2005-10-01), Marquardt et al.
patent: 2005/0230354 (2005-10-01), Hardikar
patent: 2006/0003671 (2006-01-01), Stumpf et al.

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