Apparatus and method for polishing semiconductor wafers...

Abrading – Precision device or process - or with condition responsive... – With feeding of tool or work holder

Reexamination Certificate

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Details

C451S041000, C451S028000, C451S285000, C451S288000

Reexamination Certificate

active

10765613

ABSTRACT:
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more pivotable load-and-unload cups to transfer the objects to and/or from one or more object carriers to polish the objects. Each pivotable load-and-unload cup may be configured to transfer the objects to and/or from a single object carrier. Alternatively, each pivotable load-and-unload cup may be configured to transfer the objects to and/or from two object carriers. The pivotable load-and-unload cups may be configured to be pivoted about one or more pivoting points over at least one polishing surface, such as a polishing pad surface.

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patent: 6309279 (2001-10-01), Bowman et al.
patent: 6346038 (2002-02-01), Kajiwara et al.
patent: 6575818 (2003-06-01), Jeong
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patent: 6942545 (2005-09-01), Jeong
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patent: 2003/0003852 (2003-01-01), Jeong
patent: 2003/0217811 (2003-11-01), Jeong
patent: 2004/0009738 (2004-01-01), Doi et al.
patent: 2004/0216842 (2004-11-01), Jeong
patent: 2003-0067391 (2003-08-01), None
patent: WO 03/088335 (2003-10-01), None

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