Apparatus and method for polishing semiconductor wafers...

Details Apparatus and method for polishing semiconductor wafers... Apparatus and method for polishing semiconductor wafers...

2008-05-20

2008-05-20

Wilson, Lee D (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S041000, C451S028000, C451S285000, C451S288000

Reexamination Certificate

active

10765613

ABSTRACT:
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more pivotable load-and-unload cups to transfer the objects to and/or from one or more object carriers to polish the objects. Each pivotable load-and-unload cup may be configured to transfer the objects to and/or from a single object carrier. Alternatively, each pivotable load-and-unload cup may be configured to transfer the objects to and/or from two object carriers. The pivotable load-and-unload cups may be configured to be pivoted about one or more pivoting points over at least one polishing surface, such as a polishing pad surface.

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