Abrading – Precision device or process - or with condition responsive... – With feeding of tool or work holder
Reexamination Certificate
2007-05-29
2007-05-29
Rachuba, M. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
With feeding of tool or work holder
C450S145000, C450S145000
Reexamination Certificate
active
10829593
ABSTRACT:
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces, multiple wafer carriers and at least one load-and-unload cup. The load-and-unload cup may be configured to move to and from the wafer carriers in a pivoting manner. The load-and-unload cup may be configured to move to and from the wafer carriers in a linear reciprocating manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a pivoting manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a linear reciprocating manner.
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Ham Thomas H.
Inopla Inc.
Rachuba M.
Wilson & Ham
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