Apparatus and method for polishing semiconductor device

Details Apparatus and method for polishing semiconductor device Apparatus and method for polishing semiconductor device

1997-11-05

1999-03-02

Eley, Timothy V.

Abrading

Abrading process

Glass or stone abrading

451 36, 451 59, 451288, 451533, 451550, B24B 100, B24B 2900

Patent

active

058762698

ABSTRACT:
The apparatus (method) for polishing semiconductor device is equipped with a polish pad which comprises an upper layer material and a lower layer material of differing degrees of hardness overlying one another, whereby a semiconductor wafer is polished while being pressed against the polish pad, the degree of hardness of the upper layer material of the polish pad being set at Shore spring A hardness 92-98.5, and the degree of hardness of the lower layer material of the polish pad at Shore spring A hardness 78-87.5.

REFERENCES:
patent: 3863395 (1975-02-01), Brown
patent: 4132037 (1979-01-01), Bonora
patent: 5184433 (1993-02-01), Maack
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5287663 (1994-02-01), Pierce et al.
patent: 5534106 (1996-07-01), Cote et al.
patent: 5725420 (1998-03-01), Torii

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