Abrading – Machine – Endless band tool
Patent
1997-02-21
2000-05-09
Rose, Robert A.
Abrading
Machine
Endless band tool
451297, 451 59, B24B 2104
Patent
active
060596430
ABSTRACT:
The present invention relates to an apparatus and method of Chemical Mechanical Planarization ("CMP") for wafer, flat panel display (FPD), and hard drive disk (HDD). The preferred apparatus comprises a looped belt spatially oriented in a vertical direction with respect to a ground floor. A polishing pad is glued to an outer surface of the belt. At an inner surface of the belt, there are a plurality of wafer supports to support the wafers while they are in polishing process. Wafers are loaded from a wafer station to a wafer head using a handling structure before polishing and are unloaded from the wafer head to the wafer station after polishing. An electric motor or equivalent is used to drive the looped belt running over two pulleys. An adjustment means is used to adjust the tension and position of the belt for smooth running. This new CMP machine can be mounted in multiple orientations to save manufacturing space.
REFERENCES:
patent: 2416493 (1947-02-01), Newton
patent: 5575707 (1996-11-01), Talieh et al.
patent: 5593344 (1997-01-01), Weldon et al.
patent: 5692947 (1997-12-01), Talieh et al.
patent: 5722877 (1998-03-01), Meyer et al.
Abushaban Mohamed
Furman Burford J.
Hu Albert
Aplex Inc.
Kwok Edward C.
Rose Robert A.
LandOfFree
Apparatus and method for polishing a flat surface using a belted does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for polishing a flat surface using a belted, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for polishing a flat surface using a belted will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1058976