Apparatus and method for plating a substrate

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C205S123000, C204S22400M

Reexamination Certificate

active

08048282

ABSTRACT:
A plating apparatus and method bubbles generated at the plating surfaces easily removed and the uniformity of the thickness of the plated film within the plated surface can be improved. The plating apparatus has a cassette table for loading a cassette in which a substrate having a plating surface is contained. An aligner for aligning the substrate, a rinser-dryer for rinsing and drying the substrate, and a plating unit for plating the substrate are also provided. The plating unit includes a plating vessel containing a plating solution, and a holder holds the substrate to immerse the substrate in the plating solution in the plating vessel. The plating surface is exposed to a nozzle which ejects the plating solution toward the plating surface.

REFERENCES:
patent: 4102756 (1978-07-01), Castellani et al.
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4981559 (1991-01-01), Sato et al.
patent: 5421987 (1995-06-01), Tzanavaras et al.
patent: 5437777 (1995-08-01), Kishi
patent: 5932077 (1999-08-01), Reynolds
patent: 6001235 (1999-12-01), Arken et al.
patent: 6379511 (2002-04-01), Fatula et al.
patent: 6547937 (2003-04-01), Oberlitner et al.
patent: 6921466 (2005-07-01), Hongo et al.
patent: 2001/0037945 (2001-11-01), Okase et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for plating a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for plating a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for plating a substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4309370

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.