Apparatus and method for plasma treatment of resin material

Details Apparatus and method for plasma treatment of resin material Apparatus and method for plasma treatment of resin material

1986-01-08

1989-10-17

Bueker, Richard

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

422186, 42218605, 204164, 118723, B01J 1908

Patent

active

048744530

ABSTRACT:
An apparatus for plasma treatment, capable of plasma-treating works of resin material by irradiating the surfaces of the works with a microwave discharge plasma within a vacuum reaction chamber. A plasma introducing port is formed in the wall of the reaction chamber. A plasma-irradiating pipe is connected to the plasma introducing port for injecting the plasma into the reaction chamber to irradiate the surfaces of the works. A discharge port is formed in the wall of the reaction chamber to reduce the internal pressure of the reaction chamber. A plasma diffuser includes a rotatable vane for diffusing the flow of plasma to distribute uniform density of plasma in the reaction chamber. A plurality of deflecting plates projecting from the inner wall of the reaction chamber toward the interior thereof may also be provided to diffuse the flow of plasma in the reaction chamber. In a method, a plurality of the works are rotated in relation to each other about a common axis, and also individual works are rotated independently from each other about their own axes.

REFERENCES:
patent: 4151034 (1979-04-01), Yamamoto
patent: 4160690 (1979-07-01), Shibagaki
patent: 4175235 (1979-11-01), Niwa
patent: 4434188 (1984-02-01), Kamo
patent: 4461783 (1984-07-01), Yamazaki
patent: 4501766 (1985-02-01), Suzuki

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