Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means
Reexamination Certificate
2009-05-04
2011-12-27
Zervigon, Rudy (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With measuring, sensing, detection or process control means
C118S7230AN, C118S665000, C118S663000, C118S697000, C118S695000, C118S696000, C118S713000, C118S688000, C156S345240
Reexamination Certificate
active
08083889
ABSTRACT:
A plasma etching apparatus capable of performing processing with excellent in-plane uniformity on an object to be processed having a large diameter is provided. The present invention provides a plasma etching apparatus including a processing chamber13which performs plasma processing on an object to be processed1, a first processing gas supply source40, a second processing gas supply source50, a first gas inlet65-1which introduces a processing gas into the processing chamber, second gas inlets65-2which introduce the processing gas into the processing chamber, flow rate regulators42and53which regulate the flow rate of the processing gas and a gas shunt60which divides the first processing gas into a plurality of portions, wherein at least two gas pipes branched by the shunt60are provided with the first gas inlet65-1or second gas inlets65-2and merging sections63-1and63-2are provided between the shunt60and the first gas inlet65-1and between the shunt60and the second gas inlets65-2for merging the second processing gas.
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Edamura Manabu
Miya Go
Nishio Ryoji
Yoshioka Ken
Antonelli, Terry Stout & Kraus, LLP.
Hitachi High-Technologies Corporation
Zervigon Rudy
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