Apparatus and method for photoetching of polyimides, polycarbona

Details Apparatus and method for photoetching of polyimides, polycarbona Apparatus and method for photoetching of polyimides, polycarbona

1988-04-26

1989-08-15

Powell, William A.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including variation in thickness

156643, 156646, 156655, 1566591, 156668, 156345, 428412, 4284735, B44C 122, B29C 3700

Patent

active

048573825

ABSTRACT:
Polyimides, polycarbonates, polyetherimides and other highly stable organic polymers are photoetched through the use of deep ultraviolet light produced by a broad area, non-coherent, continuous light source. This method is effective in an oxygen-free environment, but provides slightly higher etch rates in an air ambient as a result of the oxygen in the air ambient. The apparatus in which this photoetching occurs may employ a single light source or a plurality of side-by-side lamps and may include ports which allow continuous transport of samples therethrough.

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Bjorkholm, J. E. et al., "Direct Writing in Self-Developing Resists Using Low-Power CW Ultraviolet Light", Journal of Applied Physics, vol. 58 (6), 9/15/85, pp. 2098-2100.
Johnson, P. D., "Excitation of Hg.sup.+ 1942 .ANG. in the High-Current-Low-Pressure Discharge", Applied Physics Letters, vol. 18, No. 9, May 1, 1971, pp. 381-382.
van Pelt, Pieter, "Processing of Deep-Ultraviolet (UV) Resists", SPIE, vol. 275, Semiconductor Microlithography VI, 1981, pp. 150-154.

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