Apparatus and method for performing heat treatment on semiconduc

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

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219382, 219411, 118729, F27B 516

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active

050013270

ABSTRACT:
An apparatus for containing semiconductor wafers and performing heat treatment thereon. Heaters disposed in a high temperature furnace form at least one heating space therein. An insertion and retrieval aperture is disposed at the lower portion of each heating space for allowing passage of wafers therethrough. Each of the heating spaces is adapted to receive one or two wafers and to provide simultaneous and uniform heat treatment on the wafers.

REFERENCES:
patent: 3385921 (1968-05-01), Hampton
patent: 3828722 (1974-08-01), Reuter
patent: 3836751 (1974-09-01), Anderson
patent: 4101759 (1978-07-01), Anthony
patent: 4348580 (1982-09-01), Drexel
patent: 4535228 (1985-08-01), Mimura
patent: 4539933 (1985-09-01), Campbell
patent: 4579080 (1986-04-01), Martin
patent: 4610748 (1986-09-01), Engle
patent: 4649261 (1987-03-01), Sheets
patent: 4755654 (1988-07-01), Crowley
patent: 4806321 (1989-02-01), Nishizawa
Barbee, S. G., "Flat Plate . . . for LPCVD", IBM Tech. Disc. Bull., vol. 26, No. 12, May 1984, pp. 6497-6498.

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