Etching a substrate: processes – Masking of a substrate using material resistant to an etchant
Patent
1996-03-04
1998-03-10
Powell, William
Etching a substrate: processes
Masking of a substrate using material resistant to an etchant
216 11, 216 39, 216 47, 216 49, 216 51, 156345, B44C 122
Patent
active
057257884
ABSTRACT:
An apparatus (95) and method for patterning a surface of an article (30), the apparatus (95) including a large-area stamp (50) for forming a self-assembled monolayer (36) (SAM) of a molecular species (38) on the surface (34) of a layer (32) of resist material, which is formed on the surface of the article (30). The large-area stamp (50) includes a layer (52) of an elastomer and has, embedded within it, mechanical structures (68, 80) which stiffen the large-area stamp (50) and deform it to control the stamped patterns. The method includes the steps of: forming a layer (32) of resist material is on the surface of the article (30), utilizing the large-area stamp (50) to form the SAM (36) on the surface (34) of the layer (32) of resist material, etching the layer (32) of resist material, and thereafter etching or plating the surface of the article (30).
REFERENCES:
patent: 5053318 (1991-10-01), Gulla et al.
patent: 5275689 (1994-01-01), Felten et al.
patent: 5527662 (1996-06-01), Hashimoto et al.
Dworsky Lawrence N.
Goronkin Herbert
Legge Ronald N.
Maracas George N.
Motorola
Parsons Eugene A.
Powell William
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