Optical waveguides – Integrated optical circuit
Reexamination Certificate
2005-07-13
2008-07-08
Doan, Jennifer (Department: 2874)
Optical waveguides
Integrated optical circuit
C385S129000
Reexamination Certificate
active
07397978
ABSTRACT:
An apparatus is disclosed that includes a carrier structure and an optical coupling arrangement. The carrier structure is made of a silicon material and allows for the packaging and integrating of microphotonic devices onto a single chip. The optical coupling mechanism enables laser light to be coupled into and out of a microphotonic resonant disk integrated on the carrier. The carrier provides first, second and third cavities that are dimensioned so as to accommodate the insertion and snug fitting of the microphotonic resonant disk and first and second prisms that are implemented by the optical coupling arrangement to accommodate the laser coupling.
REFERENCES:
patent: 5903380 (1999-05-01), Motamedi et al.
patent: 6532326 (2003-03-01), Hutchinson et al.
patent: 7012353 (2006-03-01), Iwata
patent: 2003/0194824 (2003-10-01), Hunt
patent: 2003/0223202 (2003-12-01), Uchida
patent: 2004/0021403 (2004-02-01), Ayazi et al.
patent: 2004/0057653 (2004-03-01), Fukuda et al.
patent: 2004/0065940 (2004-04-01), Ayazi et al.
patent: WO 03/005499 (2003-01-01), None
A. Sakai et al “FD TD Simulation of Photonic Devices and Circuits Based on Circular and Fan-Shaped Microdisks” Journal of Lightwave Technology, vol. 17, No. 8, pp. 1493-1499 Aug. 8, 1999.
D. S. Burgess “Photonic Crystal Laser Features Hexagonal Ring Resonator” Photonic Research, Dec. 2002 Edition, <http:/www.photonics.com/spectra/research/xQ/ASP/pre aid.56/QX/read.htm> (Sep. 29, 2004).
Ho et al “Making Photonic Devices 1000 Times Smaller”0 Science Blog; <http:/www.scienceblog.com/community/older/1997/A/199700917.html> (Sep. 30, 2004).
Borda Gary
Doan Jennifer
Rotella Robert
The United States of America as represented by the Administrator
LandOfFree
Apparatus and method for packaging and integrating... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for packaging and integrating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for packaging and integrating... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3964749