Apparatus and method for opening a sealed module containing...

Metal working – Means to assemble or disassemble – Means to disassemble electrical device

Reexamination Certificate

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C029S256000, C029S257000

Reexamination Certificate

active

10872790

ABSTRACT:
An apparatus and method is provided which permits effective removal of a circuit board from sealed housing while minimizing stress, bending and flexing of circuit board sufficiently to prevent damage to circuit board and its electronic components. The apparatus includes a base to support the housing and a force transmitter to transmit a separation force to the exposed surfaces of one or more connectors of the circuit board. This apparatus effectively distributes the separation force across exposed surfaces of the connectors to create substantially uniform pressure on the connectors and thus the circuit board. The invention also includes steps for separating the circuit board from the housing including, in one embodiment, a separator apparatus for applying a pulling force to the connectors of the circuit board.

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patent: 2003/0229979 (2003-12-01), Kappel et al.
patent: 0 349 133 (1990-01-01), None

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