Apparatus and method for non-destructive, low stress removal of

Details Apparatus and method for non-destructive, low stress removal of Apparatus and method for non-destructive, low stress removal of

1999-12-13

2000-12-19

Pelham, Joseph

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

219392, 219393, 228119, 228264, B23K 300, B23K 3102, B23K 1018, F27B 900, F27B 936

Patent

active

061630144

ABSTRACT:
Circuit chips, such as known good die (KGD) chips, are removed from an assembly including a plurality of circuit chips attached to at least one chip carrier, or substrate. The substrate is held within a top plate with the circuit chips positioned within successive chip cavities within a bottom plate. Each chip cavity includes a load surface separated by a cascade effect pitch with respect to adjacent chip cavities. A cascade effect shear force is sequentially applied to the circuit chips to remove them from the substrate. The chips may be heated to a temperature facilitating shear within a temperature range at which solder connections are solid, and the chips further heated following disassembly to a temperature at which the solder is liquid to facilitate reforming the solder for subsequent attachment of the chip into an electronic device.

REFERENCES:
patent: 5237269 (1993-08-01), Aimi et al.
patent: 5556024 (1996-09-01), Olson et al.
patent: 5636781 (1997-06-01), Olson et al.
patent: 5707000 (1998-01-01), Olson et al.
patent: 5722579 (1998-03-01), Yu et al.
patent: 5738267 (1998-04-01), Olson et al.

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