Semiconductor device manufacturing: process – Including control responsive to sensed condition – Optical characteristic sensed
Reexamination Certificate
2005-08-25
2008-08-12
Lebentritt, Michael S. (Department: 2812)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Optical characteristic sensed
C438S014000, C438S016000, C257SE21530
Reexamination Certificate
active
07410815
ABSTRACT:
Methods and apparatus for assessing a constituent in a semiconductor substrate. Several embodiments of the invention are directed toward non-contact methods and systems for identifying an atom specie of a dopant implanted into the semiconductor substrate using techniques that do not mechanically contact the substrate with electrical leads or other types of mechanical measuring instruments. For example, one embodiment of a non-contact method of assessing a constituent in a semiconductor substrate in accordance with the invention comprises obtaining an actual reflectance spectrum of infrared radiation reflected from the semiconductor substrate, and ascertaining a plasma frequency value (ωp) and a collision frequency value (γ) for the semiconductor substrate based on the actual reflectance spectrum. This method can further include identifying a dopant type based on a relationship between dopant types and (a) plasma frequency values and (b) collision frequency values.
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Lebentritt Michael S.
Nanometrics Incorporated
Pompey Ron E
Silicon Valley Patent & Group LLP
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