Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-10-09
2007-10-09
Thompson, Gregory D. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S694000, C361S695000, C361S704000, C361S715000
Reexamination Certificate
active
10996722
ABSTRACT:
One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.
REFERENCES:
patent: 6304450 (2001-10-01), Dibene et al.
patent: 2004/0218367 (2004-11-01), Lin et al.
patent: 2006/0152907 (2006-07-01), Rathmann
Belady Christian L.
Belson Steven A.
Christenson Jeffrey P.
Harris Shaun L.
Peterson Eric C.
Hewlett--Packard Development Company, L.P.
Thompson Gregory D.
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