Apparatus and method for mounting soldering balls onto surfaces

Details Apparatus and method for mounting soldering balls onto surfaces Apparatus and method for mounting soldering balls onto surfaces

1995-05-12

1997-10-28

Ramsey, Kenneth J.

Metal fusion bonding

Process

Preplacing solid filler

228223, 22818022, 118425, B23K 1018

Patent

active

056809840

ABSTRACT:
An absorber head 10 picks up a plurality of soldering balls 1 from a container 2, and is shifted horizontally toward a substrate 31. In the midway of this shift movement, the absorber head 10 is stopped just above a flux storage 32 and then lowered to soak the soldering ball 1 in the flux 34 stored in the flux storage 32, thereby applying each soldering ball 1 with an adequate amount of flux. Thereafter, the absorber head 10 is again shifted horizontally until it reaches the substrate 31. Then, the absorber head 10 lowers the soldering ball 1 applied with flux, so that each soldering ball 1 is mounted on a corresponding electrode 31a provided on the substrate 31. If any soldering balls 1 are left in the flux storage 32 due to failure of the pickup operation by the absorber head 10, such soldering balls 1 are surely collected in a groove 36 by a wiping movement of a squeegee 37 which is associated with the flux storage 32.

REFERENCES:
patent: 5284287 (1994-02-01), Wilson et al.
patent: 5330574 (1994-07-01), Nakagawa et al.

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