Optics: measuring and testing – Shape or surface configuration – Triangulation
Reexamination Certificate
2007-03-20
2007-03-20
Pham, Hoa Q. (Department: 2877)
Optics: measuring and testing
Shape or surface configuration
Triangulation
C356S606000, C356S630000
Reexamination Certificate
active
10938430
ABSTRACT:
An apparatus for mounting semiconductor chips onto a substrate contains a measuring station for the contactless measurement of the height of the surface of the mounted semiconductor chip facing away from the substrate at a minimum of three locations. From this, at least one parameter is calculated that characterises the adhesive layer formed between the semiconductor chip and the substrate. A difference of the measured value to a set value is used to adjust the mounting process. An apparatus for wiring semiconductor chips also contains such a measuring station in order to determine the individual height of each connection point on the semiconductor chip. This information is used in order to lower the capillary to the respective connection point on the semiconductor chip in the shortest possible time.
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Pham Hoa Q.
Ritchie David B.
Thelen Reid Brown Raysman & Steiner LLP
Unaxis International Trading Ltd
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