Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1996-05-23
1998-03-24
Kincaid, Kristine L.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257704, 257730, H01L 2302
Patent
active
057315426
ABSTRACT:
The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension region has a surface that is substantially coplanar with the second side (82). There is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82).
REFERENCES:
patent: 3725566 (1973-04-01), Plizak
patent: 4399484 (1983-08-01), Mayer
patent: 4542076 (1985-09-01), Bednarz et al.
patent: 4706164 (1987-11-01), L'Henaff et al.
patent: 4711431 (1987-12-01), Viannay et al.
patent: 4847731 (1989-07-01), Smolley
patent: 4854377 (1989-08-01), Komoto et al.
patent: 4884167 (1989-11-01), Mine
patent: 4935864 (1990-06-01), Schmidt et al.
patent: 4945980 (1990-08-01), Umezawa
patent: 4964019 (1990-10-01), Belanger, Jr.
patent: 5014777 (1991-05-01), Sano
patent: 5050037 (1991-09-01), Yamamoto et al.
patent: 5057968 (1991-10-01), Morrison
patent: 5131233 (1992-07-01), Cray et al.
patent: 5166863 (1992-11-01), Shmunis
patent: 5174364 (1992-12-01), Mizuno
patent: 5175395 (1992-12-01), Moore
patent: 5177666 (1993-01-01), Bland et al.
patent: 5190099 (1993-03-01), Mon
patent: 5210440 (1993-05-01), Long
patent: 5220804 (1993-06-01), Tilton et al.
patent: 5232164 (1993-08-01), Resch et al.
patent: 5256833 (1993-10-01), Schwenk
patent: 5264984 (1993-11-01), Akamatsu
patent: 5285351 (1994-02-01), Ikeda
patent: 5289363 (1994-02-01), Ferchau et al.
patent: 5329419 (1994-07-01), Umezawa
patent: 5348076 (1994-09-01), Asakawa
patent: 5360993 (1994-11-01), Mine
patent: 5371408 (1994-12-01), Moulton et al.
patent: 5384687 (1995-01-01), Sano
patent: 5388030 (1995-02-01), Gasser et al.
patent: 5431974 (1995-07-01), Pierce
patent: 5436501 (1995-07-01), Ikeda
patent: 5436793 (1995-07-01), Sanwo et al.
patent: 5463528 (1995-10-01), Umezawa
patent: 5477081 (1995-12-01), Nagayoshi
patent: 5483423 (1996-01-01), Lewis et al.
patent: 5491363 (1996-02-01), Yoshikawa
M. Ghodbane et al., "Experimental Study of Spray Cooling with Freon-113", Int. J. Heat Mass Transfer, vol. 34, No. 4/5, pp. 1163-1174 (1991).
J.P. Holman et al., "Extended Studies of Spray Cooling with Freon-113", Int. J. Heat Mass Transfer, vol. 36, No. 8, pp. 2239-2241 (1992).
Donald E. Tilton et al., "High-Flux Spray Cooling in a Simulated Multichip Module", HTD--vol. 206-2, Topics in Heat Transfer--vol. 2, ASME (1992).
S.K. Chen et al., "Factors Influencing the Effective Spray Cone Angle of Pressure-Swirl Atomizers", Journal of Engineering for Gas Turbines and Power, vol. 114, pp. 97-103 (Jan. 1992).
Donald Tilton et al., "Advanced Thermal Management for Multichip Modules", Electronic Packaging and Production, pp. 71-73 (Aug. 1995).
Kurt A. Estes et al., "Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays", Journal of Electronic Packaging, vol. 117, pp. 323-332 (Dec. 1995).
Kurt A. Estes et al., "Correlation of Sauter Mean Diameter and Critical Heat Flux for Spray Cooling of Small Surfaces", Int. J. Heat Mass Transfer, vol. 38, No. 16, pp. 2985-2996 (1995).
Limper-Brenner Linda
McDunn Kevin J.
Press Minoo D.
Schmidt Detlef W.
Creps Heather L.
Kincaid Kristine L.
Motorola Inc.
Ngo Hung V.
LandOfFree
Apparatus and method for mounting an electronic component to a s does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for mounting an electronic component to a s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for mounting an electronic component to a s will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2290487