Apparatus and method for mounting a component to an electrical c

Details Apparatus and method for mounting a component to an electrical c Apparatus and method for mounting a component to an electrical c

1995-10-05

1997-07-08

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257691, H01L 2310, H01L 2334

Patent

active

056464444

ABSTRACT:
An apparatus to improve upon the problem of mismatched CTEs in electrical circuits comprises a small heat sink (206), a substrate (202), and an aperture existing within the substrate (202). The heat sink (206) is located on one side of the substrate (202) in a location substantially overlapping the aperture (204). The transistor (106) is coupled to the heat sink (206) and extends through the aperture (204). The apparatus reduces manufacturing costs since no exotic bonding agents are needed to accommodate for the mismatch in CTEs. Additionally, the apparatus reduces the number of substrates required during the manufacturing process, and allows for the heat sink (206) to be soldered in an automated fashion to the bottom of the substrate (202) in much the same way component parts are reflowed onto the top of a printed circuit board.

REFERENCES:
patent: 5262927 (1993-11-01), Chia et al.
patent: 5392193 (1995-02-01), Robertson, Jr. et al.
patent: 5394298 (1995-02-01), Sagisaka
patent: 5465008 (1995-11-01), Goetz et al.

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