Apparatus and method for mounting a chip

Details Apparatus and method for mounting a chip Apparatus and method for mounting a chip

1996-07-31

1998-11-24

Krizek, Janice L.

Metal working

Means to assemble or disassemble

Means to assemble electrical device

29759, 29809, 4147447, B23P 2100

Patent

active

058391878

ABSTRACT:
An apparatus and a method for mounting a chip make it possible to accomplish quick chip mounting and also to mount multiple different chips on substrates. Three heads are provided around a center rod of a head assembly; they horizontally rotate around the center rod. When the heads rotate horizontally, they are turned 180 degrees vertically by a first bevel gear and a second bevel gear. A nozzle of one of the heads picks up a flip chip from a wafer sheet and rotates 180 degrees horizontally to transfer the flip chip to a transferring head, during which it vertically inverts 180 degrees so as to vertically invert the flip chip. The transferring head receives the flip chip from the head and mounts it on a substrate. According to the type of chips to be mounted, the heads and the transferring head are equipped with nozzles best suited for the type of chips.

REFERENCES:
patent: 4372802 (1983-02-01), Harigane et al.
patent: 4556362 (1985-12-01), Bahnck et al.
patent: 5305518 (1994-04-01), Okumoto
patent: 5692293 (1997-12-01), Igarashi et al.

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