Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-02-26
2001-01-16
Gandhi, Jayprakash N. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S756000, C361S788000, C361S802000, C361S829000, C312S223100, C211S041170, C220S004020
Reexamination Certificate
active
06175507
ABSTRACT:
FIELD OF THE INVENTION
This invention relates generally to the field of electronic chassis that house electronic components for high speed telecommunication and networking applications and, in particular, to an apparatus and method for mounting a backplane circuit board to an electronic chassis.
BACKGROUND OF THE INVENTION
An electronic chassis which houses electronic components for high speed telecommunication and networking applications typically includes two card guide assemblies mounted between side walls of the chassis, one located adjacent the top of the chassis and the other located adjacent the bottom of the chassis. A backplane circuit board having various surface mounted connectors is typically fastened to the two card guide assemblies and forms the back wall of the chassis. A plurality of vertically oriented circuit board assemblies, each of which are typically comprised of a circuit board attached to a U-shaped channel member, are typically inserted into the chassis along the card guide assemblies. When fully inserted into the chassis, the circuit boards are connected to the backplane circuit board.
In order to make the connections between the vertically oriented circuit boards within the chassis and the backplane circuit board, it is critical that the backplane circuit board be properly aligned with the chassis. Attempts have made to provide proper alignment by providing additional openings in the backplane circuit board and manually aligning the backplane circuit board prior to fastening it to the chassis. However, providing additional openings and manually aligning the backplane circuit board is labor intensive, time consuming, and results in increased manufacturing costs. Moreover, existing designs do not compensate for any deviations from specified design tolerances of the components of the chassis that may result during the fabrication process. As a result, deviations from design tolerances may make it difficult, if not impossible, to obtain proper alignment of the backplane circuit board.
Accordingly, it would be desirable to have an apparatus for mounting a backplane circuit board to an electronic chassis that overcomes the disadvantages described above.
SUMMARY OF THE INVENTION
One aspect of the invention provides an apparatus for mounting a backplane circuit board to an electronic chassis. An electronic chassis includes a first card guide assembly and a second card guide assembly. The first card guide assembly includes first and second guide pins. The first guide pin of the first card guide assembly is positioned adjacent a first end of the first card guide assembly and the second guide pin of the first card guide assembly is positioned adjacent a second end of the first card guide assembly. The second card guide assembly includes first and second guide pins. The first guide pin of the second card guide assembly is positioned adjacent a first end of the second card guide assembly and the second guide pin of the second card guide assembly is positioned adjacent a second end of the second card guide assembly. A backplane circuit board includes first and second openings to receive the first and second guide pins of the first card guide assembly and third and fourth openings to receive the first and second guide pins of the second card guide assembly. The third and fourth openings have a diameter less than a diameter of the first and second openings to allow a user to first position a bottom portion of the backplane circuit board against the second card guide assembly wherein the third and fourth openings receive the first and second guide pins of the second card guide assembly and second, to position a top portion of the backplane circuit board against the first card guide assembly wherein the first and second openings receive the first and second guide pins of the first card guide assembly to allow proper alignment of the backplane circuit board to the first and second card guide assemblies. The first and second guide pins of the first card guide assembly and the first and second guide pins of the second card guide assembly may preferably each include a tapered end portion. The backplane circuit board may preferably be comprised of at least two circuit boards. Each of the first and second openings may preferably be 0.215 inches in diameter. Each of the third and fourth openings may preferably be 0.200 inches in diameter. The first and second guide pins of the first card guide assembly and the first and second guide pins of the second card guide assembly may each be 0.187 inches in diameter. The first and second guide pins of the first card guide assembly and the first and second guide pins of the second card guide assembly may each be 0.375 inches in length. The first and second guide pins of the first card guide assembly and the first and second guide pins of the second card guide assembly may each be comprised of metallic material.
Another aspect of the invention provides a method of mounting a backplane circuit board to an electronic chassis. An electronic chassis including a first card guide assembly and a second card guide assembly is provided. The first card guide assembly includes first and second guide pins. The first guide pin of the first card guide assembly is positioned adjacent a first end of the first card guide assembly and the second guide pin of the first card guide assembly is positioned adjacent a second end of the first card guide assembly. The second card guide assembly includes first and second guide pins. The first guide pin of the second card guide assembly is positioned adjacent a first end of the second card guide assembly and the second guide pin of the second card guide assembly is positioned adjacent a second end of the second card guide assembly. A backplane circuit board includes first and second openings to receive the first and second guide pins of the first card guide assembly and third and fourth openings to receive the first and second guide pins of the second card guide assembly. The third and fourth openings have a diameter less than a diameter of the first and second openings. A bottom portion of the backplane circuit board is first positioned against the second card guide assembly, and the first and second guide pins of the second card guide assembly are received in the third and fourth bottom openings. A top portion of the backplane circuit board is then positioned against the first card guide assembly, and the first and second guide pins of the first card guide assembly are received in the first and second openings. The backplane circuit board may preferably be attached to the first and second card guide assemblies.
The invention provides the foregoing and other features, and the advantages of the invention will become further apparent from the following detailed description of the presently preferred embodiments, read in conjunction with the accompanying drawings. The detailed description and drawings are merely illustrative of the invention and do not limit the scope of the invention, which is defined by the appended claims and equivalents thereof.
REFERENCES:
patent: 3447036 (1969-05-01), Dore et al.
patent: 4012672 (1977-03-01), Douglass et al.
patent: 4602829 (1986-07-01), De Andrea
patent: 4853830 (1989-08-01), Corfits et al.
patent: 5173845 (1992-12-01), Shaw
patent: 5745349 (1998-04-01), Lemke
Greco Gerald A.
Koradia Amir
Pogatetz Douglas J.
Ravlin Philip A.
3Com Corporation
Baniak Pine & Gannon
Gandhi Jayprakash N.
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