Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2006-03-07
2006-03-07
Shakeri, Hadi (Department: 3723)
Abrading
Abrading process
Glass or stone abrading
C451S005000, C451S159000, C451S285000
Reexamination Certificate
active
07008299
ABSTRACT:
Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a method for polishing a workpiece includes determining an estimated frequency of serial defects in a workpiece, pressing the workpiece against a polishing pad and moving the workpiece relative to the pad. The method further includes vibrating the workpiece and/or the pad at a frequency that is greater than the estimated frequency of the serial defects. In one aspect of this embodiment, determining the estimated frequency of serial defects can include: determining a relative velocity between the workpiece and the polishing pad; estimating the length of a mark on the workpiece; estimating the time a particle in a planarizing solution is in contact with the workpiece; and estimating the number of cracks in the workpiece.
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Seiichi Kondo, Noriyuki Sakuma, Yoshio Homma, Yasushi Goto, Naofumi Ohashi, Hizuru Yamaguchi, and Nobuo Owada, “Abrasive-Free Polishing for Copper Damascene Interconnection”,Journal of the Electrochemical Society, 147 (10) pp. 3907-3913 (2000).
Micro)n Technology, Inc.
Perkins Coie LLP
Shakeri Hadi
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