Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-09-24
1999-04-20
Engel, James
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156351, 156361, 226 20, B32B 3100
Patent
active
058955356
ABSTRACT:
An apparatus and method for measuring web alignment at a splice disposed between a trailing end of an expiring web and a leading end of a new web. The apparatus includes a speed monitor monitoring the moving webs. A splice sensor indicates the presence and absence of the splice while an edge sensor provides a signal indicating the position of the edge relative to a reference position. The edge signals are manipulated to provide a skew and offset value which provides a measurement of web alignment.
REFERENCES:
patent: 3935979 (1976-02-01), Hickey
patent: 4021031 (1977-05-01), Meihofer et al.
patent: 4297585 (1981-10-01), Puschmann
patent: 4381586 (1983-05-01), Abler
patent: 4392910 (1983-07-01), Tokuno et al.
patent: 4652329 (1987-03-01), Focke
patent: 4837715 (1989-06-01), Ungpiyakul et al.
patent: 5045134 (1991-09-01), Schenker et al.
patent: 5235515 (1993-08-01), Ungpiyakul et al.
patent: 5271284 (1993-12-01), Still et al.
patent: 5277731 (1994-01-01), Krimsky et al.
patent: 5285235 (1994-02-01), Frick
patent: 5305099 (1994-04-01), Morcos
patent: 5437749 (1995-08-01), Pipkorn et al.
patent: 5604565 (1997-02-01), Takanashi
"Gauge Measures Mismatch and Peaking at Welds", by Stephen S. Gordon, NASA Technical Briefs, Dec. 1996 p. 104.
Eastman Kodak Company
Engel James
Parulski Susan L.
LandOfFree
Apparatus and method for measuring web alignment at a splice does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for measuring web alignment at a splice, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for measuring web alignment at a splice will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2245863