Apparatus and method for measuring the thickness of a thin...

Optics: measuring and testing – By light interference – Using fiber or waveguide interferometer

Reexamination Certificate

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C356S504000

Reexamination Certificate

active

09471829

ABSTRACT:
A thin film thickness measurement apparatus that can measure immediately after film growth thickness of a thin film of a substrate that is grown includes a light receiving/projecting unit directing light substantially perpendicular to the substrate and receiving light reflected from the substrate, and an analyze unit analyzing thickness of a thin film of the substrate according to intensity of reflected light received by the light receiving/projecting unit.

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Korean Patent Office Action (Notice of Ground of Rejection).
Office Action and English language translation of the Office Action. The Office Action was mailed on Sep. 28, 2004 in connection with the counterpart Japanese Patent Application No. H11-195925.
Japanese Patent Office Action mailed Mar. 22, 2005 and English Translation.
Korean Patent Office Action (Notice of ground of Rejection) 2005.
Korean Patent Office Action (Notice Of Ground Of Rejection).

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