Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2005-01-25
2005-01-25
Fuqua, Shawntina (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S405000, C219S411000, C392S416000, C392S418000, C118S724000, C374S121000, C374S123000, C374S126000, C250S492100, C250S50400H
Reexamination Certificate
active
06847012
ABSTRACT:
The invention relates to a device for measuring the temperature of substrates, notably semiconductor wafers. The device comprises at least one radiation sensor for measuring the radiation emitted by the substrate and an element (19) which restricts the field of vision of the radiation sensor and is positioned between the substrate and the radiation sensor. The substrate temperature can be determined correctly and simply, even if the substrate vibrates or is tilting, owing to the fact that the edges (20) of the element extend in a straight line. The invention also relates to a corresponding method.
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Patent Abstracts of Japan 5-187922(A).
Becker R W.
Fuqua Shawntina
R W Becker & Associates
Steag RTP Systems GmbH
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