Apparatus and method for measuring adhesive bond strength

Details Apparatus and method for measuring adhesive bond strength Apparatus and method for measuring adhesive bond strength

1980-10-21

1982-08-31

Swisher, S. Clement

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

73150A, G01N 324, G01N 3344

Patent

active

043466028

ABSTRACT:
An improved apparatus is disclosed for measuring the adhesive bond strength etween two materials. A short, cylindrical specimen (28) having a test surface of one material is attached to a rigid base (12) on which a slide (16) is mounted on preloaded rollers (22) for movement along a pair of tracks (14) provided on the base. Above the specimen, a rigid mold block (36) is supported on an axially extending arm (24) formed integrally with the slide (16). The peripheries (32, 38) of the specimen and the mold block are essentially aligned so that seal ring (50) may be moved into engagement with a narrow gap formed between the specimen and the mold block. The second material, whose adhesive bond to the first material is to be determined, is introduced into the volume defined between the mold block and the specimen and caused or allowed to solidify there. The seal ring is then moved away from the gap and a force is applied to the slide to move it along the base, thereby applying a shear force to the adhesive bond between the two materials. The force and deformation are measured at which failure of the adhesive bond occurs. A method of using such an apparatus also is disclosed.

REFERENCES:
patent: T916005 (1973-11-01), Dolen et al.
patent: 2720106 (1955-10-01), Lippman
patent: 3030797 (1962-04-01), Lacks et al.
patent: 3046567 (1968-10-01), Terry

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