Abrading – Abrading process – With tool treating or forming
Patent
1995-04-03
1996-12-10
Kisliuk, Bruce M.
Abrading
Abrading process
With tool treating or forming
451 21, 451 28, 125 1103, 125 1302, B24B 100
Patent
active
055825362
ABSTRACT:
It is an object of the present invention to provide an apparatus and a method for manufacturing a wafer, which are the most suitable for meeting the requirement for the mirror grinding surface of the wafer's chamfering portion. As a result, when the ingot is sliced, a wafer being sliced is chamfered at the same time. And, it is also possible that before the ingot starts to be sliced by the blade, the grindstone is pressed against the outer periphery of the slicing position to form a V-shaped groove along the outer periphery of the slicing position, so that the chamfering can be performed.
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Banks Derris H.
Kisliuk Bruce M.
Tokyo Seimitsu Co. Ltd.
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