Apparatus and method for manufacturing semiconductor device

Details Apparatus and method for manufacturing semiconductor device Apparatus and method for manufacturing semiconductor device

1997-11-13

2000-06-20

Evans, Geoffrey S.

Electric heating

Metal heating

For bonding with pressure

219 8514, 438106, B23K 100

Patent

active

060780207

ABSTRACT:
In semiconductor device manufacturing apparatus and method, in a joining process of a semiconductor pellet (2) and a package (1), the semiconductor pellet (2) is kept to a temperature equilibrium state under an actual use temperature condition while a low melting-point soldering member (3) is interposed between the semiconductor pellet (2) and the package (1), and the electrode pads (9) on the upper surface of the semiconductor pellet (2) and the electrode terminals (8) of the collet (5), which is electrically connected to the output terminal of a high voltage electric pulse source (4), are fitted and electrically connected to each other. Subsequently, a high voltage electric pulse is produced in the high voltage electric pulse source (4) and applied to the electrode pads (9) to melt the low melting-point soldering member (3), causing joining of the package (1) and the semiconductor pellet (2). The joining treatment can be performed under the actual use temperature condition of the semiconductor pellet (2), and thermal stress to the semiconductor pellet (2) is suppressed and the lifetime of the semiconductor pellet (2) can be increased.

REFERENCES:
patent: 2813191 (1957-11-01), Gray
patent: 3197608 (1965-07-01), Ingraham
patent: 3660632 (1972-05-01), Leinkram
patent: 3790738 (1974-02-01), Laub et al.
patent: 4322599 (1982-03-01), Cardinal
patent: 4389557 (1983-06-01), Devenyi et al.
patent: 4506139 (1985-03-01), Daughton
patent: 4817849 (1989-04-01), Yamamoto et al.
patent: 5262355 (1993-11-01), Nishiguchi et al.
patent: 5410807 (1995-05-01), Bross et al.
patent: 5996222 (1999-12-01), Shangguan et al.

Affiliated with

Also associated with

Rating

Apparatus and method for manufacturing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for manufacturing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for manufacturing semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1855116