Apparatus and method for manufacturing encapsulated products

Package making – Methods – Forming or partial forming a receptacle and subsequent filling

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Details

53140, 53560, 53 51, B65B 4710, B65B 904

Patent

active

057618860

ABSTRACT:
Methods and apparatus for forming capsules provides novel processing flexibility including dies which are independently movable, even during capsule formation, the ability to vary the speed of the dies even during the formation of a single capsule, independently controlled drums and dies. Advantageously, at least one and most preferably a plurality of independently actuatable pumps are provided for greater control over the dispensing of fill material. For example, the fill rate can be varied during the filling of a single capsule. Preferred embodiments provide electric/electronic signals to actuate the f fill material dispensers, provide for the independent control of rotatable drums, rotatable dies and the dispensers.

REFERENCES:
patent: 2288327 (1942-06-01), Scherer
patent: 2624164 (1953-01-01), Donofrio
patent: 2663129 (1953-12-01), Donofrio
patent: 2697317 (1954-12-01), Stirn et al.
patent: 3092942 (1963-06-01), Chasman
patent: 3465496 (1969-09-01), Hansen
patent: 3916598 (1975-11-01), Adams et al.
patent: 4506488 (1985-03-01), Matt et al.
patent: 4567714 (1986-02-01), Chasman
patent: 4817367 (1989-04-01), Ishikawa et al.
patent: 5388387 (1995-02-01), McElvy

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