Apparatus and method for manufacturing a semiconductor device

Details Apparatus and method for manufacturing a semiconductor device Apparatus and method for manufacturing a semiconductor device

2006-05-26

2009-11-24

Davis, Robert B (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

C425S116000, C425S127000

Reexamination Certificate

active

07622067

ABSTRACT:
An apparatus for manufacturing a semiconductor device includes an upper mold (21), a lower mold (22), and a plate (30, 130, 230) that includes at least one cavity (31) that receives resin and defines an outer shape and a thickness of a resin sealing portion, and a gate (32) through which the resin is guided to the cavity (31), the plate (30) being interposed between the upper mold (21) and the lower mold (22). The plate (130) further includes a resin film (132) fixed by viscoelastic or adhesive bonding to a side of thin plates (131) towards a substrate on which electrodes are provided. The semiconductor device is provided which has no resin burrs that occur on a substrate in an end portion of the molded body. The plate (30, 130, 230) is formed by multiple thin plates (231, 232, 233) joined by welding or positioned by positioning pins (237, 238).

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