Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2005-07-14
2009-06-09
Trinh, Michael (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S678000, C257SE21022
Reexamination Certificate
active
07545021
ABSTRACT:
Semiconductor package assemblies having integrated circuits mounted onto passive electrical components. The assemblies each include an inductor having a magnetic core and an wire wrapped around the magnetic core. An integrated circuit die is positioned either on or within a recess formed in the magnetic core of the inductor. Electrical traces are formed on the magnetic core. The electrical traces are configured to electrically couple the inductive wire of the inductor with the integrated circuit die positioned on or recessed within the inductor.
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Doyle James T.
Sagen Eric Anthony
Beyer Law Group LLP
National Semiconductor Corporation
Trinh Michael
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