Apparatus and method for machining conductive structures on subs

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

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G03F 900

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058718680

ABSTRACT:
The present invention is an apparatus and method for machining a laminate structure to form a selected shape. The method includes forming a first layer on a substrate. A first protective structure is defined that is attached to each of the first layer and the substrate. At least a portion of the protective structure has the selected shape. The laminate structure is then machined along the first protective structure thereby forming at least a portion of the selected shape.

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patent: 3656988 (1972-04-01), Steffen et al.
patent: 4675246 (1987-06-01), Kundinger et al.
patent: 4764485 (1988-08-01), Loughran et al.
patent: 4954383 (1990-09-01), King et al.
patent: 4959119 (1990-09-01), Lantzer
Electronics Manufacturing Productivity Facility, Electrecon '91 Proceedings, Oct. 22-23, 1991.

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