Apparatus and method for loading a wafer in polishing system

Details Apparatus and method for loading a wafer in polishing system Apparatus and method for loading a wafer in polishing system

2005-08-23

2005-08-23

Thomas, David B. (Department: 3723)

Abrading

Abrading process

Utilizing nonrigid tool

C451S011000, C451S285000

Reexamination Certificate

active

06932679

ABSTRACT:
The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

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