Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-02-04
1995-11-21
Osele, Mark A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156157, 1563043, 156505, 242551, 242553, 2425561, B65H 6906, B65H 2100
Patent
active
054683211
ABSTRACT:
Apparatus and method for joining, while stationary, an expiring web to a new web in such a way that the joined webs lie in one plane. To this end, the new web and the expiring web are brought together and are simultaneously cut through along one cutting line. Subsequently, at least on one side, a bonding strip is applied over the web parts to be joined. The beam-shaped unit has a first contact surface for the new web. In line therewith and on the same side of the travel path, a second contact surface is arranged for the expiring web. That part of the new web which is located downstream of the cutting line, is situated at a distance from the expiring web. By retaining each of the web parts to be joined against an associated contact surface, it is possible to achieve an accurate join.
REFERENCES:
patent: 2987108 (1961-06-01), Kilmartin
patent: 3554842 (1971-01-01), Byrt
patent: 3719542 (1973-03-01), Schmitz et al.
patent: 3939031 (1976-02-01), Takimoto
patent: 4120739 (1978-10-01), Peeters et al.
patent: 4331301 (1982-05-01), Martinez
patent: 5318646 (1994-06-01), Cardini et al.
Research Disclosure Nr. 201, Jan. 1981, Havant GB, pp. 19-20, "Means for Generating A Controlled Butt Splice Gap".
Buchmeyer Theodoor A.
Van Liempt Martinus J. C.
Osele Mark A.
Stork Contiweb B.V.
LandOfFree
Apparatus and method for joining two webs together does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for joining two webs together, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for joining two webs together will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1134182