Data processing: measuring – calibrating – or testing – Measurement system – Weight
Reexamination Certificate
2005-11-21
2008-03-04
Gibson, Randy W (Department: 2841)
Data processing: measuring, calibrating, or testing
Measurement system
Weight
C177S050000, C438S005000, C438S014000, C216S059000, C216S084000, C257S632000
Reexamination Certificate
active
07340372
ABSTRACT:
In order to determine the dielectric constant of a layer deposited on a semiconductor wafer (2), the density of the layer is obtained. To obtain that density, the wafer (2) without the layer is weighed in a weighing chamber (4) in which a weighing pan (7) supports the wafer on a weighing balance. The weight of the wafer is determined taking into account the buoyancy exerted by the air on the wafer (2). Then the layer is deposited on the wafer (2) and the weighing operation repeated. Alternatively a reference wafer may be used. If the material of the layer is known, the weight of the layer can be used to derive its density using a thickness measurement. Alternatively, if the density is known, the thickness can be obtained.
REFERENCES:
patent: 3949295 (1976-04-01), Moorshead
patent: 4666005 (1987-05-01), Komoto et al.
patent: 4713724 (1987-12-01), Voelkel
patent: 4783597 (1988-11-01), Misawa et al.
patent: 5321634 (1994-06-01), Obata et al.
patent: 5625170 (1997-04-01), Poris
patent: 5719796 (1998-02-01), Chen
patent: 5750938 (1998-05-01), De Caris et al.
patent: 6790376 (2004-09-01), Markle et al.
patent: 3106534 (1982-10-01), None
patent: 0932194 (1999-07-01), None
patent: 1296367 (2003-03-01), None
patent: 30199908 (1991-08-01), None
“Field and Wave Electromagnetics” Cheng, David K.; Syracuse University Addison-Wesley Publishing Co.; Reading, MA; pp. 95-105; Mar. 1995.
A. Courtot-Descharles, F. Pires, P. Paillet, J.L. Leray; “Density functional theory applied to the calculation of dielectric constant of low-k materials:” Microelectronics Reliabilitv. vol. 39. pp. 279-284. 1999.
Gibson Randy W
Hunt, Jr. Ross F.
Metryx Limited
Stites & Harbison PLLC
LandOfFree
Apparatus and method for investigating parameters of layers... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for investigating parameters of layers..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for investigating parameters of layers... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3976719