Apparatus and method for interconnecting leads in a high...

Details Apparatus and method for interconnecting leads in a high... Apparatus and method for interconnecting leads in a high...

2005-05-24

2005-05-24

Lefkowitz, Edward (Department: 2855)

Measuring and testing

Fluid pressure gauge

With pressure and/or temperature compensation

C073S746000, C338S306000, C338S308000

Reexamination Certificate

active

06895822

ABSTRACT:
A novel method for interconnecting leads in a high pressure transducer without the use of solder employs a ceramic disc containing a number of through holes. Each hole has a tube inserted therein, which tubes are connected to the disc by brazing or a high temperature attachment. Each tube protrudes from both sides of the ceramic. The ceramic is coated in appropriate areas with molymanganese film, which is over plated with gold. This overcoat forms a brazed compound surface attached to the tubes of the ceramic. A semiconductor pressure transducer has output leads which are inserted through the ceramic into each tube. The other side end of the tube receives high temperature wires from a suitable connecting device. Each tube is then crimped and spot-welded to hold both the lead from the transducer and the high temperature leads to produce a strong bond without the use of solder. The header itself it typically welded to a pressure point.

REFERENCES:
patent: 3800264 (1974-03-01), Kurtz et al.
patent: 4106349 (1978-08-01), Kurtz
patent: 4815472 (1989-03-01), Wise et al.
patent: 4881410 (1989-11-01), Wise et al.
patent: 4994781 (1991-02-01), Sahagen
patent: 5973590 (1999-10-01), Kurtz et al.
patent: 6363792 (2002-04-01), Kurtz et al.
patent: 6530282 (2003-03-01), Kurtz et al.
patent: 6679099 (2004-01-01), Fujita et al.

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