Metal working – Barrier layer or semiconductor device making
Patent
1990-07-06
1992-05-19
Chaudhuri, Olik
Metal working
Barrier layer or semiconductor device making
437220, 228102, 2281802, 228 9, 228 491, 29827, 29740, 29833, 29834, 382 8, 358101, 358107, H01L 2160, H01L 2158
Patent
active
051135655
ABSTRACT:
A method is described for aligning a contact pattern on an electronic device held by a first movable support, with a bond site pattern on a lead frame held by a second movable support. The method includes the steps of: (a) creating and storing models of a chip's contact pattern and a lead frame's bond site pattern; (b) imaging the electronic device and lead frame; (c) determining the position of contacts on said electronic device and reorienting the contact pattern model to a best fit with the imaged contact position; (d) determining the position of each bond site on the imaged lead frame and reorienting the bond site model to a best fit with the imaged bond site position; (e) determining positional differences between the reoriented lead frame and contact pattern models; and (f) generating signals to reorient the first and second movable supports to minimize the positional differences when they are moved into a bonding positon. A machine is described for performing the above method wherein each of three main movable elements of the machine is assigned a dimensional axis in which its travel is non-adjustable, so that other movable elements can be calibrated thereagainst.
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Cipolla Thomas M.
Coteus Paul W.
Johnson Glen W.
Murphy Philip
Oden Christopher W.
Chaudhuri Olik
Graybill David E.
International Business Machines Corp.
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