Apparatus and method for inspecting film carrier tape for...

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control

Reexamination Certificate

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C156S378000, C156S379000

Reexamination Certificate

active

10783114

ABSTRACT:
An apparatus and method for inspecting a film carrier tape for mounting electronic component, in which film carrier tapes for mounting electronic component provided with a plurality of electronic component mounting portions in multiple strips in a transverse direction are exactly used and which can be inspected simultaneously, so that inspection efficiency can be greatly enhanced. Furthermore, the film carrier tapes for mounting electronic component are separated into individual strips after inspection and can be taken up on individual reels without a winding shift. A film carrier tape for mounting electronic component in multiple strips which are unwound from an unwinding device, is cut into individual film carrier tapes for mounting electronic component in stripes strips by a slit device, then caused to run in parallel with each other and simultaneously inspected in an inspecting section, then they are simultaneously taken up on a plurality of take-up reels attached to an identical take-up shaft of a take-up device in parallel with each other, respectively.

REFERENCES:
patent: 09-092692 (1997-04-01), None
patent: 10-256278 (1998-09-01), None
patent: 2000-182061 (2000-06-01), None
patent: 2000-227401 (2000-08-01), None
patent: 2001-035891 (2001-02-01), None
patent: 2001-345345 (2001-12-01), None
patent: 2003-332392 (2003-11-01), None
Translation of JP 2001-035891 (Japanese reference submitted with Jun. 7, 2004 IDS).

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