Material or article handling – Load carried along a horizontal linear path
Reexamination Certificate
2000-07-06
2001-11-27
Ellis, Christopher P. (Department: 3652)
Material or article handling
Load carried along a horizontal linear path
C414S800000, C414S808000, C414S810000, C052S118000
Reexamination Certificate
active
06322313
ABSTRACT:
FIELD OF THE INVENTION
This invention relates generally to an apparatus and method for inserting a wafer, substrate or other article into a process module, and specifically, to an apparatus and method for inserting a wafer into a process module that provides a telescoping loading arm having a relatively long extension while requiring a relatively small footprint.
BACKGROUND OF THE INVENTION
A semiconductor wafer electroplating apparatus typically performs a wafer plating process within an enclosed and self-contained environment. One reason for this is to prevent contaminants from entering a wafer electroplating apparatus and adversely affecting the plating process. Another reason is typically toxic/corrosive fluids and gasses are involved in the plating process and containing them within an enclosed and self-contained environment is an environmental and safety requirement. Yet another reason for an enclosed and self-contained environment is to achieve a better control of the quantity, pressure, volume and other parameters of the fluids and gasses involved in the plating process.
Because of the enclosed and self-contained environment of a wafer electroplating apparatus, a wafer needs to be inserted into the plating apparatus to set the wafer at the plating process staging area. In many cases, plating apparatuses or other process modules are relatively large in size because they have to house electronics, mechanical parts, tubing, internal chambers, sumps, and other components. Accordingly, often a wafer needs to travel a long distance from outside of the process module into the process staging area of the module. Because of the relatively light weight characteristic of wafer, the transporting of the wafer into and from a process module should be performed with substantial control to avoid dislocation of the wafer from its appropriate position. Thus, there is a need for a system and method of transporting a wafer, substrate, or other articles into and out of a process module with substantial control, even though the wafer may travel a relatively long distance.
Another problem with inserting a wafer, substrate or other article into a plating apparatus or other process module arises from the need or desire to reduce the size of these machines. Since clean room real estate is a valuable commodity, there is a need to make efficient use of space. Thus, the sizes of plating apparatuses and other process modules have been substantially reduced in recent years. Because these process modules often house a substantial amount of components, process modules are becoming more crowded internally with components. As a result, it is sometimes difficult to insert a wafer, substrate or other article into a process module because of a relatively small clearance requirement. Thus, there is a need for a system and method of transporting a wafer, substrate, or other article into and out of a process module that has a relatively low profile (thickness) to allow an article to be inserted within a relatively small clearance.
Yet another problem with inserting a wafer, substrate or other article into a plating apparatus or other process module arises from the relatively high precision requirement in placing a wafer into a process staging area. A process staging area for a wafer electroplating apparatus includes cathode contacts that electrically connect to the top surface of the wafer, typically at very precise locations. Often, wafer electroplating apparatus include alignment mechanism so that the wafer is precisely placed in the process staging area. However, typically the wafer has to be transported within an alignment zone for the alignment mechanism to work properly. This still may require a relatively high level of precision, especially given the long distance the wafer has to travel from outside to the inside of the process module. Thus, there is a need for a system and method of transporting a wafer, substrate, or other article into and out of a process module with substantial precision.
In summary, there is a need for a system and method of transporting a wafer, substrate, or other article into and out of a process module that (1) has substantial control in inserting an article into a process module even though the article has to travel a relatively long distance, that (2) has a relatively low profile (thickness) to allow an article to be inserted within a relatively small clearance, and that (3) has substantial precision in placing of the article. Such a system and method is provided herein in accordance with the invention.
SUMMARY OF THE INVENTION
An aspect of the invention includes an apparatus for inserting and removing a wafer into and from a plating apparatus, comprising an elongated primary arm including a wafer seat for supporting the wafer, an elongated secondary arm for supporting the primary arm, and a mounting surface for supporting the secondary arm. The apparatus further includes a drive band mechanically coupled to the primary arm for causing the movement thereof. The drive band includes a portion wound around a drum that is driven by a motor. The motor causes the drive band to move the primary arm along an axis between a retracted position wherein the primary arm, the secondary arm, and the mounting surface are in a stacked relationship, and an extended position wherein the secondary arm protrudes from the mounting surface along the axis, and the primary arm protrudes from the secondary arm along the axis.
The drive band is preferably made out of stainless steel and has a concaveshaped cross-section for providing improved strength and rigidity during the extensions of the primary and secondary arms. The motor, which is preferably a stepper motor, provides substantial control in extending and retracting the primary and secondary arms. The mounting surface includes horizontally-oriented opposing rollers for guiding the movement of the secondary arm along the axis, and the secondary arm likewise includes horizontally-oriented opposing rollers for guiding the movement of the primary arm arm along the axis. Both the primary and secondary arm are comprised of a relatively thin plate, and this feature in combination with the horizontally-oriented rollers, gives the apparatus a low-profile characteristic to allow the wafer to be inserted within a relatively small clearance.
Another aspect of the invention includes a method of inserting and removing an article into a process staging area of a process module using an apparatus that includes a primary arm having a seat supporting the article, a secondary arm that supports the primary arm, and a mounting surface that supports the secondary arm. The method comprises a first step of moving the primary arm along an axis from a retracted position to a first intermediate position. In the retracted position, the primary arm, the secondary arm, and the mounting surface are in a stacked relationship. Also in this position, the article seated on the primary arm remains outside of the process staging area. In the first intermediate position, the secondary arm and the mounting surface are in a stacked relationship and the primary arm protrudes from the secondary arm along the axis.
The second step is moving the primary and secondary arms together along the axis from the first intermediate position to an extended position. In the extended position, the secondary arm protrudes from the mounting surface along the axis and the primary arm protrudes from the secondary arm along the axis. Also in this position, the article is now proximate the process staging area. The third step is moving the primary arm along the axis from the extended position to a second intermediate position. In the second intermediate position, the primary arm and the secondary arm are in a stack relationship, but both protrude from the mouting surface along the axis. The final step is moving the primary and secondary arms together along the axis from the second intermediate position to the retracted position wherein the article is again outside of the process staging area.
In summary
Downes Gary C.
Kaufman Robert
Blakely , Sokoloff, Taylor & Zafman LLP
Bower Kenneth W
Ellis Christopher P.
Technic Inc.
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