Optics: measuring and testing – Position or displacement – Triangulation
Reexamination Certificate
2008-05-09
2009-11-03
Pham, Hoa Q (Department: 2886)
Optics: measuring and testing
Position or displacement
Triangulation
C438S016000, C438S617000, C438S007000
Reexamination Certificate
active
07612895
ABSTRACT:
An apparatus and a method for semiconductor wafer bonding provide in-situ and real time monitoring of semiconductor wafer bonding time. Deflection of the wafer edges during the last phase of the direct bonding process indicates the end of the bonding process. The apparatus utilizes a distance sensor to measure the deflection of the wafer edges and the bonding time is measured as the time between applying the force (bonding initiation) and completion of the bonding process. The bonding time is used as a real-time quality control parameter for the wafer bonding process.
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Gabriel Markus
Stiles Matthew
AKC Patents LLC
Collins Aliki K.
Pham Hoa Q
SUSS MicroTec Inc
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